ANABOND 652C Heat Transfer Compound
- Stock: 2
- SKU: 9156 | DAD117
-
Rs. 194.70 (inc GST)
Rs.165.00 + GSTQty :
GST Invoice: Available for all purchases — eligible for input tax credit.
Delivery: 2–8 days across India. No MOQ required.
Bulk Orders: Need more quantity or not in stock? Email: dnatechindia [at] gmail.com
Import Service: We import a wide range of electronic components on request.
ANABOND 652C Heat Transfer Compound
ANABOND 652C Heat Transfer Compound
ANABOND 652C Heat Transfer Compound is a high-performance, non-curing silicone-based thermal interface material designed to enhance heat dissipation in electronic assemblies. Formulated with metallic oxide fillers, it offers excellent thermal conductivity while maintaining electrical insulation. Its stable, non-hardening paste ensures long-term reliability without drying out or separating.
DNA solutions, Nashik has various types of Heat Sink's. Check out our complete collection of Heat Sink's.
- Superior Thermal Conductivity: Facilitates efficient heat transfer between electronic components and heat sinks.
- Electrical Insulation: Prevents electrical shorts, ensuring component safety.
- Wide Operating Temperature Range: Remains stable from -50°C to +200°C, with short-term exposure up to 220°C
- Non-Curing Paste: Maintains consistency over time, eliminating the need for reapplication.
- Excellent Dielectric Properties: High dielectric strength and volume resistivity.
Specifications of ANABOND 652C Heat Transfer Compound
- Appearance: Smooth, milky white paste
- Base Material: Silicone-based compound with metallic oxides
- Operating Temperature: -50°C to +200°C
- Dielectric Strength: ≥ 7.2 kV/mm
Applications of ANABOND 652C Heat Transfer Compound
- Electronics Assembly
- Power Electronics
- LED Lighting
- Automotive Electronics
Package Includes
1 x ANABOND 652C Heat Transfer Compound
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