ANABOND 652C Heat Transfer Compound

ANABOND 652C Heat Transfer Compound

ANABOND 652C Heat Transfer Compound is a high-performance, non-curing silicone-based thermal interface material designed to enhance heat dissipation in electronic assemblies. Formulated with metallic oxide fillers, it offers excellent thermal conductivity while maintaining electrical insulation. Its stable, non-hardening paste ensures long-term reliability without drying out or separating.

DNA solutions, Nashik has various types of Heat Sink's. Check out our complete collection of Heat Sink's.

• Superior Thermal Conductivity: Facilitates efficient heat transfer between electronic components and heat sinks.

• Electrical Insulation: Prevents electrical shorts, ensuring component safety.

• Wide Operating Temperature Range: Remains stable from -50°C to +200°C, with short-term exposure up to 220°C

• Non-Curing Paste: Maintains consistency over time, eliminating the need for reapplication.

• Excellent Dielectric Properties: High dielectric strength and volume resistivity.

Specifications of ANABOND 652C Heat Transfer Compound

• Appearance: Smooth, milky white paste

• Base Material: Silicone-based compound with metallic oxides

• Operating Temperature: -50°C to +200°C

• Dielectric Strength: ≥ 7.2 kV/mm

Applications of ANABOND 652C Heat Transfer Compound

• Electronics Assembly

• Power Electronics

• LED Lighting

• Automotive Electronics

Package Includes 

      1 x ANABOND 652C Heat Transfer Compound